Keeping Powerful Processors Reliable.
Local heating and differences in material expansion can bend a processor package. Our three-person team explored how lid geometry and materials could reduce that deformation.
Team simulation results in two separate design comparisons.
The Design Question
How can a low-cost lid reduce package deformation while balancing thermal performance and mechanical reliability?
My Contribution
My main responsibility was Task 2, lid design: reviewing prior concepts, screening materials and building a cost–performance matrix. I also wrote the report and integrated the team’s documents.
The Design Insight
Changing the geometry reduced peak stress by about 14%. A separate underfill comparison achieved a larger reduction, showing why interface behaviour deserved attention alongside lid shape.
The results are simulation-based and do not establish measured hardware performance or fatigue life.
Team: Hiroyuki Sakuma, Lok Teng Cheung and Dennis Gao. Source: Low-Cost Robust Thermal Solution for High Power AI/Datacenter Processors, supplied ECTC 2026 team report. Competition placement is recorded in the résumé and engineering portfolio.
